RD38F4455LVYTQ0 vs PF38F2040W0YTQ0 feature comparison

RD38F4455LVYTQ0 Intel Corporation

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PF38F2040W0YTQ0 Intel Corporation

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code BGA BGA
Package Description LFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32
Pin Count 88 88
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns 70 ns
Additional Feature CONTAINS 256M BIT FLASH; CONTAINS 64M BIT PSRAM CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e0 e1
Length 13 mm 10 mm
Memory Density 268435456 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM+SRAM
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 16777216 words 4194304 words
Number of Words Code 16000000 4000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 16MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA88,8X12,32 BGA88,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Standby Current-Max 0.00015 A 0.000045 A
Supply Current-Max 0.045 mA 0.055 mA
Supply Voltage-Max (Vsup) 2 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 11 mm 8 mm
Base Number Matches 1 3
Moisture Sensitivity Level 3

Compare RD38F4455LVYTQ0 with alternatives

Compare PF38F2040W0YTQ0 with alternatives