RD9.1SB
vs
BZX384-C9V1,115
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NEC ELECTRONICS AMERICA INC
|
NXP SEMICONDUCTORS
|
| Package Description |
R-PDSO-G2
|
PLASTIC, SMD, SC-76, 2 PIN
|
| Reach Compliance Code |
unknown
|
compliant
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
R-PDSO-G2
|
R-PDSO-G2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.2 W
|
0.3 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
9.06 V
|
9.1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Tol-Max |
5.8%
|
5%
|
| Working Test Current |
5 mA
|
5 mA
|
| Base Number Matches |
3
|
2
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOD
|
| Pin Count |
|
2
|
| Manufacturer Package Code |
|
SOD323
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Dynamic Impedance-Max |
|
100 Ω
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
150 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare RD9.1SB with alternatives
Compare BZX384-C9V1,115 with alternatives