REC8-2405SRWZ/H2/A/M/SMD
vs
JTF0824S05
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
RECOM POWER GMBH
|
XP POWER LTD
|
Package Description |
, GWDIP9/24,1
|
Module-9
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Samacsys Manufacturer |
RECOM Power
|
XP POWER
|
Additional Feature |
SEATED HGT CALCULATED
|
|
Analog IC - Other Type |
DC-DC REGULATED POWER SUPPLY MODULE
|
DC-DC REGULATED POWER SUPPLY MODULE
|
Input Voltage-Max |
36 V
|
36 V
|
Input Voltage-Min |
9 V
|
9 V
|
Input Voltage-Nom |
24 V
|
24 V
|
JESD-30 Code |
R-MDMA-G18
|
R-XDMA-P9
|
JESD-609 Code |
e1
|
|
Length |
32 mm
|
31.75 mm
|
Load Regulation-Max |
0.5%
|
0.5%
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
18
|
9
|
Operating Temperature-Max |
71 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
1.6 A
|
|
Output Voltage-Max |
5.075 V
|
5.06 V
|
Output Voltage-Min |
4.925 V
|
4.94 V
|
Output Voltage-Nom |
5 V
|
5 V
|
Package Body Material |
METAL
|
UNSPECIFIED
|
Package Equivalence Code |
GWDIP9/24,1
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
11.45 mm
|
10.66 mm
|
Surface Mount |
YES
|
NO
|
Technology |
HYBRID
|
HYBRID
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form |
GULL WING
|
PIN/PEG
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Total Power Output-Max |
8 W
|
8 W
|
Trim/Adjustable Output |
NO
|
NO
|
Width |
20.3 mm
|
20.32 mm
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
MODULE
|
Pin Count |
|
24/9
|
|
|
|