RK73B1JGBC564J vs MCR03FZHJ564 feature comparison

RK73B1JGBC564J KOA Speer Electronics Inc

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MCR03FZHJ564 ROHM Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer KOA SPEER ELECTRONICS INC ROHM CO LTD
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
Construction Chip Chip
JESD-609 Code e4 e3
Manufacturer Series RK73B1J(G5%TOL) MCR03
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method Bulk TR, PAPER
Rated Power Dissipation (P) 0.1 W 0.1 W
Resistance 560000 Ω 560000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Series RK73B1J(G 5% TOL) MCR03(J,200PPM)
Size Code 0603 0603
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Gold (Au) - with Nickel (Ni) barrier Tin (Sn)
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 2 1
Package Description CHIP
HTS Code 8533.21.00.30
Mounting Feature SURFACE MOUNT
Package Shape RECTANGULAR PACKAGE
Rated Temperature 70 °C
Surface Mount YES
Terminal Shape WRAPAROUND

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