RLS4448TE11C
vs
PMLL4448
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ROHM CO LTD
|
NXP SEMICONDUCTORS
|
| Package Description |
O-MELF-R2
|
HERMETIC SEALED, GLASS PACKAGE-2
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.70
|
8541.10.00.70
|
| Base Number Matches |
1
|
5
|
| Pin Count |
|
2
|
| Samacsys Manufacturer |
|
NXP
|
| Additional Feature |
|
HIGH SPEED SWITCH
|
| Case Connection |
|
ISOLATED
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
|
1 V
|
| JESD-30 Code |
|
O-LELF-R2
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Non-rep Pk Forward Current-Max |
|
2 A
|
| Number of Elements |
|
1
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
200 °C
|
| Output Current-Max |
|
0.2 A
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Dissipation-Max |
|
0.5 W
|
| Qualification Status |
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
|
100 V
|
| Reverse Current-Max |
|
0.025 µA
|
| Reverse Recovery Time-Max |
|
0.004 µs
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Form |
|
WRAP AROUND
|
| Terminal Position |
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare RLS4448TE11C with alternatives
Compare PMLL4448 with alternatives