RM06F56R2CTDK
vs
D11AP10056R21%B5
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
CAL-CHIP ELECTRONICS INC
|
VISHAY INTERTECHNOLOGY INC
|
| Package Description |
CHIP
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| Construction |
Rectangular
|
Chip
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.45 mm
|
0.45 mm
|
| Package Length |
1.6 mm
|
1.55 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.8 mm
|
0.85 mm
|
| Packing Method |
TR, PAPER, 7 INCH
|
TR, Blister, 7 Inch
|
| Rated Power Dissipation (P) |
0.1 W
|
0.1 W
|
| Rated Temperature |
70 °C
|
|
| Resistance |
56.2 Ω
|
56.2 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0603
|
0603
|
| Surface Mount |
YES
|
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Shape |
WRAPAROUND
|
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
75 V
|
75 V
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e4
|
| Terminal Finish |
|
Silver/Palladium (Ag/Pd)
|
|
|
|
Compare RM06F56R2CTDK with alternatives
Compare D11AP10056R21%B5 with alternatives