RN1810E-I/RM110
vs
CY15B004J-SXA
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INFINEON TECHNOLOGIES AG
|
| Package Description |
MODULE-37
|
SOIC-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
5A992.C
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Microchip
|
Infineon
|
| JESD-30 Code |
R-XXMA-N37
|
R-PDSO-G8
|
| Length |
26.67 mm
|
4.889 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
37
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
XMA
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
2.159 mm
|
1.727 mm
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
NO
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
UNSPECIFIED
|
DUAL
|
| Width |
17.78 mm
|
3.8985 mm
|
| Base Number Matches |
1
|
2
|
| Factory Lead Time |
|
2 Days
|
| JESD-609 Code |
|
e3
|
| Memory Density |
|
4096 bit
|
| Memory IC Type |
|
MEMORY CIRCUIT
|
| Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
3
|
| Number of Words |
|
512 words
|
| Number of Words Code |
|
512
|
| Operating Mode |
|
SYNCHRONOUS
|
| Organization |
|
512X8
|
| Supply Voltage-Max (Vsup) |
|
3.65 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare RN1810E-I/RM110 with alternatives
Compare CY15B004J-SXA with alternatives