RP130N451B-TR-FE
vs
MCP1824ST-5002E/DB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NISSHINBO MICRO DEVICES INC
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| Adjustability |
FIXED
|
FIXED
|
| Dropout Voltage1-Max |
0.37 V
|
0.32 V
|
| Dropout Voltage1-Nom |
0.24 V
|
0.2 V
|
| Input Voltage Absolute-Max |
7 V
|
6.5 V
|
| Input Voltage-Max |
6.5 V
|
6 V
|
| Input Voltage-Min |
5 V
|
5.445 V
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G3
|
| Length |
2.9 mm
|
6.5 mm
|
| Line Regulation-Max |
0.00675%
|
0.0047175%
|
| Load Regulation-Max |
0.03%
|
0.05%
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
5
|
3
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current1-Max |
0.15 A
|
0.3 A
|
| Output Voltage1-Max |
4.5675 V
|
5.125 V
|
| Output Voltage1-Min |
4.4325 V
|
4.875 V
|
| Output Voltage1-Nom |
4.5 V
|
5 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
SOP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
SOT-223
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Packing Method |
TR
|
TR
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
1.3 mm
|
1.8 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
2.3 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Tolerance-Max |
1.5%
|
2.5%
|
| Width |
1.6 mm
|
3.5 mm
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOT-223
|
| Package Description |
|
SOP, SOT-223
|
| Pin Count |
|
4
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
17 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Screening Level |
|
TS 16949
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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