RS1KE3G
vs
FFM106
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
RECTRON LTD
|
| Package Description |
GREEN, PLASTIC, CLIP SMA, 2 PIN
|
PLASTIC PACKAGE-2
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-214AC
|
DO-214AC
|
| JESD-30 Code |
R-PDSO-C2
|
R-PDSO-C2
|
| JESD-609 Code |
e3
|
e3
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
250
|
260
|
| Rep Pk Reverse Voltage-Max |
800 V
|
800 V
|
| Reverse Recovery Time-Max |
0.5 µs
|
0.5 µs
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
C BEND
|
C BEND
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
| Base Number Matches |
1
|
5
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DO-214AC
|
| Pin Count |
|
2
|
| Additional Feature |
|
METALLURGICALLY BONDED, LOW LEAKAGE CURRENT
|
| Forward Voltage-Max (VF) |
|
1.3 V
|
| Non-rep Pk Forward Current-Max |
|
30 A
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare RS1KE3G with alternatives
Compare FFM106 with alternatives