S-13L41AF vs S-13L41AF feature comparison

S-13L41AF ABLIC Inc.

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S-13L41AF Epson Electronics America Inc

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SEIKO INSTRUMENTS USA INC SEIKO EPSON CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP20,.3 SOP,
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 4 4
Clock Frequency-Max 0.5 MHz 0.5 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0
Length 12.6 mm 12.6 mm
Number of I/O Lines 14 14
Number of Terminals 20 20
On Chip Program ROM Width 8
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -10 °C -10 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
RAM (bytes) 8
ROM (words) 768
ROM Programmability MROM MROM
Seated Height-Max 2.2 mm 2.2 mm
Speed 0.5 MHz 0.5 MHz
Supply Current-Max 0.4 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 1.5 V 1.2 V
Supply Voltage-Nom 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.5 mm 5.5 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1