S2009TB
vs
L80227
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
LSI CORP
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
LBGA,
|
LFQFP, QFP64,.47SQ,20
|
| Pin Count |
208
|
64
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B208
|
S-PQFP-G64
|
| Length |
23 mm
|
10 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
208
|
64
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
240
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.65 mm
|
1.6 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Telecom IC Type |
ETHERNET TRANSCEIVER
|
ETHERNET TRANSCEIVER
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
23 mm
|
10 mm
|
| Base Number Matches |
1
|
2
|
| Data Rate |
|
100000 Mbps
|
| JESD-609 Code |
|
e0
|
| Number of Transceivers |
|
2
|
| Package Equivalence Code |
|
QFP64,.47SQ,20
|
| Supply Current-Max |
|
0.14 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare S2009TB with alternatives
Compare L80227 with alternatives