S5LS20216ASGWTMEP
vs
S5LS20216ASZWTQQ1
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Not Recommended
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA,
|
NFBGA-337
|
| Pin Count |
337
|
337
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
22
|
22
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| CPU Family |
CORTEX-R4F
|
CORTEX-R4F
|
| Clock Frequency-Max |
20 MHz
|
20 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
16
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PBGA-B337
|
S-PBGA-B337
|
| JESD-609 Code |
e0
|
e1
|
| Length |
16 mm
|
15 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of DMA Channels |
16
|
16
|
| Number of External Interrupts |
|
8
|
| Number of I/O Lines |
115
|
115
|
| Number of Serial I/Os |
7
|
9
|
| Number of Terminals |
337
|
337
|
| Number of Timers |
32
|
32
|
| On Chip Data RAM Width |
8
|
8
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| PWM Channels |
YES
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
220
|
260
|
| RAM (bytes) |
163840
|
163840
|
| ROM (words) |
2097152
|
2097152
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.4 mm
|
1.4 mm
|
| Speed |
160 MHz
|
160 MHz
|
| Supply Current-Max |
580 mA
|
580 mA
|
| Supply Voltage-Max |
1.65 V
|
1.65 V
|
| Supply Voltage-Min |
1.35 V
|
1.35 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
NOT SPECIFIED
|
| Width |
16 mm
|
15 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Package Equivalence Code |
|
BGA337,19X19,32
|
| Qualification Status |
|
Not Qualified
|
| RAM (words) |
|
160
|
| Screening Level |
|
AEC-Q100
|
|
|
|
Compare S5LS20216ASGWTMEP with alternatives
Compare S5LS20216ASZWTQQ1 with alternatives