S82S25F vs AM27S03/BEA feature comparison

S82S25F Philips Semiconductors

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AM27S03/BEA AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP ADVANCED MICRO DEVICES INC
Package Description , DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 60 ns 50 ns
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Memory Density 64 bit 64 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 16 16
Number of Words 16 words 16 words
Number of Words Code 16 16
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 16X4 16X4
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 2
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 16
JESD-609 Code e0
Length 19.431 mm
Output Characteristics 3-STATE
Package Code DIP
Package Equivalence Code DIP16,.3
Screening Level 38535Q/M;38534H;883B
Seated Height-Max 5.08 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 7.62 mm

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Compare AM27S03/BEA with alternatives