S9S08AW60MFGE vs MC9S08AW60CFGER feature comparison

S9S08AW60MFGE Freescale Semiconductor

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MC9S08AW60CFGER NXP Semiconductors

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Part Life Cycle Code Transferred Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description LQFP, 10 X 10 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MS-026BCB, LQFP-44
Pin Count 44
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G44 S-PQFP-G44
Length 10 mm 10 mm
Number of I/O Lines 54 54
Number of Terminals 44 44
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Qualification Status Not Qualified Not Qualified
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e3
Moisture Sensitivity Level 3
On Chip Program ROM Width 8
Package Equivalence Code QFP44,.47SQ,32
Peak Reflow Temperature (Cel) 260
RAM (bytes) 2048
ROM (words) 63280
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

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Compare MC9S08AW60CFGER with alternatives