S9S08SG8E2MTG vs S9S08SG8E2WTG feature comparison

S9S08SG8E2MTG NXP Semiconductors

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S9S08SG8E2WTG NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description ROHS COMPLIANT, TSSOP-16 ROHS COMPLIANT, TSSOP-16
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 16 Weeks 16 Weeks
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e3 e3
Length 5 mm 5 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 12 12
Number of Terminals 16 16
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 512
ROM (words) 8192
ROM Programmability FLASH FLASH
Screening Level AEC-Q100
Seated Height-Max 1.2 mm 1.2 mm
Speed 40 MHz 36 MHz
Supply Current-Max 120 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 2.7 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40 40
Width 4.4 mm 4.4 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 3

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