SA575DG
vs
SA572DTBR2G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
| Part Package Code |
SOIC-20 WB
|
TSSOP-16
|
| Package Description |
SOIC-20
|
TSSOP-16
|
| Pin Count |
20
|
16
|
| Manufacturer Package Code |
751D-05
|
948F-01
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
onsemi
|
onsemi
|
| Analog IC - Other Type |
COMPANDER
|
COMPANDER
|
| Bandwidth-Nom |
3 MHz
|
0.02 MHz
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e4
|
| Length |
12.8 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Equivalence Code |
SOP20,.4
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Positive Input Voltage-Max |
7 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
1.2 mm
|
| Supply Current-Max (Isup) |
5.5 mA
|
6.3 mA
|
| Supply Voltage-Max (Vsup) |
7 V
|
22 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
7.5 mm
|
4.4 mm
|
| Base Number Matches |
1
|
1
|
| Factory Lead Time |
|
4 Weeks
|
| Technology |
|
BIPOLAR
|
|
|
|
Compare SA575DG with alternatives
Compare SA572DTBR2G with alternatives