SA58640DK
vs
UPC8002GR
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NEC ELECTRONICS CORP
|
| Package Description |
SSOP20,.25
|
LSSOP,
|
| Reach Compliance Code |
unknown
|
compliant
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-30 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
SSOP20,.25
|
|
| Power Supplies |
5 V
|
|
| Supply Current-Max |
6 mA
|
2.2 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SSOP
|
| Pin Count |
|
20
|
| HTS Code |
|
8542.39.00.01
|
| JESD-30 Code |
|
R-PDSO-G20
|
| JESD-609 Code |
|
e0
|
| Number of Functions |
|
1
|
| Package Code |
|
LSSOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.45 mm
|
| Supply Voltage-Nom |
|
3 V
|
| Telecom IC Type |
|
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
| Temperature Grade |
|
OTHER
|
| Terminal Finish |
|
TIN LEAD
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
4.4 mm
|
|
|
|
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