SA606DK/01
vs
SA606D,602
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SSOP
|
SOP
|
| Package Description |
4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20
|
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| JESD-609 Code |
e4
|
|
| Length |
6.5 mm
|
12.8 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.5 mm
|
2.65 mm
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
4.4 mm
|
7.5 mm
|
| Base Number Matches |
4
|
1
|
| Manufacturer Package Code |
|
SOT163-1
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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