SA608DK
vs
SI4703-C19-GMR
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
SILICON LABORATORIES INC
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| JESD-609 Code |
e0
|
|
| Mounting Feature |
SURFACE MOUNT
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Equivalence Code |
TSSOP20,.25
|
|
| Power Supplies |
3 V
|
|
| Supply Current-Max |
4.2 mA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
QFN
|
| Package Description |
|
3 X 3 MM, ROHS COMPLIANT, QFN-20
|
| Pin Count |
|
20
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Samacsys Manufacturer |
|
Silicon Labs
|
| Built-in IF Amplifier |
|
YES
|
| Consumer IC Type |
|
AUDIO TUNER
|
| Input Frequency-Max (RF) |
|
108 MHz
|
| Input Frequency-Min (RF) |
|
76 MHz
|
| JESD-30 Code |
|
S-XQCC-N20
|
| Length |
|
3 mm
|
| Noise Figure-Nom |
|
58 dB
|
| Number of Bands |
|
2
|
| Number of Functions |
|
1
|
| Package Code |
|
HVQCCN
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.6 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
2.7 V
|
| Temperature Grade |
|
OTHER
|
| Terminal Form |
|
NO LEAD
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
3 mm
|
|
|
|
Compare SI4703-C19-GMR with alternatives