SAB-C163-L25F
vs
SAB-C165-L25F
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
METRIC, PLASTIC, TQFP-100
|
LFQFP,
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
24
|
24
|
| Bit Size |
16
|
16
|
| CPU Family |
80166
|
|
| Clock Frequency-Max |
25 MHz
|
50 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
|
| Length |
14 mm
|
14 mm
|
| Number of I/O Lines |
77
|
77
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
YES
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP100,.63SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
1024
|
|
| ROM Programmability |
MROM
|
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Speed |
25 MHz
|
25 MHz
|
| Supply Current-Max |
97.5 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
1
|
|
|
|