SAB-C501G-LP
vs
SST89V516RD2-33-C-PIE
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SIEMENS A G
SILICON STORAGE TECHNOLOGY INC
Package Description
,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
16
16
Bit Size
8
8
Clock Frequency-Max
12 MHz
33 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
8
8
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
Number of I/O Lines
32
32
Number of Terminals
40
40
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
PWM Channels
NO
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Speed
12 MHz
33 MHz
Supply Current-Max
21 mA
Supply Voltage-Max
5.5 V
3.6 V
Supply Voltage-Min
4.25 V
2.7 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
1
Rohs Code
Yes
Part Package Code
DIP
Pin Count
40
ECCN Code
3A991.A.2
JESD-609 Code
e3
Length
51.943 mm
Peak Reflow Temperature (Cel)
260
ROM Programmability
FLASH
Seated Height-Max
5.588 mm
Supply Voltage-Nom
3 V
Terminal Finish
Matte Tin (Sn)
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
40
Width
15.24 mm
Compare SAB-C501G-LP with alternatives
Compare SST89V516RD2-33-C-PIE with alternatives