SAB8032B-16-P
vs
DS80C310-MCG
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
SIEMENS A G
|
DALLAS SEMICONDUCTOR
|
| Package Description |
,
|
0.600 INCH, PLASTIC, DIP-40
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
NO
|
NO
|
| Additional Feature |
POWER-DOWN PIN VPD 4.5 - 5.5V; BOOLEAN PROCESSOR
|
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
16 MHz
|
25 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
R-PDIP-T40
|
R-PDIP-T40
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
|
| Number of I/O Lines |
32
|
32
|
| Number of Serial I/Os |
1
|
|
| Number of Terminals |
40
|
40
|
| Number of Timers |
3
|
|
| On Chip Data RAM Width |
8
|
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
256
|
|
| Speed |
16 MHz
|
25 MHz
|
| Supply Current-Max |
175 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
NMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| CPU Family |
|
8051
|
| JESD-609 Code |
|
e0
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP40,.6
|
| RAM (bytes) |
|
256
|
| ROM Programmability |
|
MROM
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
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