SB80L186EB13 vs TSB80L188EA13 feature comparison

SB80L186EB13 Intel Corporation

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TSB80L188EA13 Intel Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer INTEL CORP INTEL CORP
Part Package Code QFP QFP
Package Description LFQFP, QFP80,.55SQ,20 LFQFP,
Pin Count 80 80
Reach Compliance Code unknown compliant
Factory Lead Time 4 Weeks
Address Bus Width 20 20
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 26 MHz 26 MHz
External Data Bus Width 16 8
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-PQFP-G80 S-PQFP-G80
JESD-609 Code e0
Length 12 mm 12 mm
Low Power Mode YES YES
Number of Terminals 80 80
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Equivalence Code QFP80,.55SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 3/5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.66 mm 1.66 mm
Speed 13 MHz 13 MHz
Supply Current-Max 73 mA 65 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 2.7 V 2.7 V
Supply Voltage-Nom 3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 12 mm 12 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 3 1
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS
Number of DMA Channels 2
Number of External Interrupts 5
Number of Serial I/Os
On Chip Data RAM Width
RAM (words) 0

Compare SB80L186EB13 with alternatives

Compare TSB80L188EA13 with alternatives