SC28L198A1BE,551
vs
SCC2698BC1N64
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
LFQFP, QFP100,.63SQ,20
|
DIP, DIP64,.9
|
| Pin Count |
100
|
|
| Manufacturer Package Code |
SOT407-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO OPERATES AT 3.3V SUPPLY
|
|
| Address Bus Width |
8
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
8 MHz
|
|
| Communication Protocol |
SYNC, HDLC; SYNC, SDLC; ADCCP
|
|
| Data Transfer Rate-Max |
0.06103515625 MBps
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
S-PQFP-G100
|
R-PDIP-T64
|
| JESD-609 Code |
e3
|
e0
|
| Length |
14 mm
|
|
| Low Power Mode |
YES
|
|
| Moisture Sensitivity Level |
2
|
|
| Number of Serial I/Os |
8
|
|
| Number of Terminals |
100
|
64
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
DIP
|
| Package Equivalence Code |
QFP100,.63SQ,20
|
DIP64,.9
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
3
|
|
|
|
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