SCF5250CAG120
vs
21281CB
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS INC
|
| Package Description |
20 X 20 MM, 1.40 MM THICKNESS, 0.50 MM PITCH, ROHS COMPLIANT, QFP-144
|
LFQFP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| Factory Lead Time |
52 Weeks
|
|
| Additional Feature |
ALSO REQUIRES 3.3V SUPPLY
|
|
| Address Bus Width |
25
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
33.86 MHz
|
200 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
NO
|
| JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
| JESD-609 Code |
e3
|
|
| Length |
20 mm
|
20 mm
|
| Low Power Mode |
YES
|
YES
|
| Moisture Sensitivity Level |
3
|
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
1.6 mm
|
1.7 mm
|
| Speed |
120 MHz
|
200 MHz
|
| Supply Voltage-Max |
1.32 V
|
1.815 V
|
| Supply Voltage-Min |
1.08 V
|
1.485 V
|
| Supply Voltage-Nom |
1.2 V
|
1.65 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin (Sn)
|
NOT SPECIFIED
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
20 mm
|
20 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
144
|
| Qualification Status |
|
COMMERCIAL
|
|
|
|
Compare SCF5250CAG120 with alternatives