SCN8032HCFN40 vs SCN8032HCFN40 feature comparison

SCN8032HCFN40 YAGEO Corporation

Buy Now Datasheet

SCN8032HCFN40 NXP Semiconductors

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer PHILIPS COMPONENTS NXP SEMICONDUCTORS
Package Description DIP-40 DIP-40
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
Clock Frequency-Max 15 MHz 15 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Speed 15 MHz 7.5 MHz
Supply Current-Max 175 mA 175 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Additional Feature BOOLEAN PROCESSOR
Boundary Scan NO
Format FIXED POINT
Integrated Cache NO
Length 52 mm
Low Power Mode NO
Number of DMA Channels
Number of External Interrupts 2
Number of Serial I/Os 1
Number of Timers 3
On Chip Data RAM Width 8
Package Code DIP
RAM (words) 256
Seated Height-Max 4.7 mm
Supply Voltage-Nom 5 V
Terminal Pitch 2.54 mm
Width 15.24 mm