SD1462
vs
MRF327
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI CORP
|
TE CONNECTIVITY LTD
|
Package Description |
FLANGE MOUNT, O-PXFM-F6
|
|
Pin Count |
6
|
4
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
Collector Current-Max (IC) |
8 A
|
9 A
|
Collector-Emitter Voltage-Max |
33 V
|
33 V
|
Configuration |
SINGLE WITH BUILT-IN RESISTOR
|
SINGLE
|
Highest Frequency Band |
ULTRA HIGH FREQUENCY BAND
|
ULTRA HIGH FREQUENCY BAND
|
JESD-30 Code |
O-PXFM-F6
|
O-CXFM-F6
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
175 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation-Max (Abs) |
220 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
FLAT
|
FLAT
|
Terminal Position |
UNSPECIFIED
|
UNSPECIFIED
|
Transistor Application |
AMPLIFIER
|
AMPLIFIER
|
Transistor Element Material |
SILICON
|
SILICON
|
Transition Frequency-Nom (fT) |
400 MHz
|
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Manufacturer Package Code |
|
CASE 316-01
|
Additional Feature |
|
HIGH RELIABILITY
|
Case Connection |
|
ISOLATED
|
Collector-Base Capacitance-Max |
|
125 pF
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|