SDR1GSMM vs 1SS181TE85R feature comparison

SDR1GSMM Solid State Devices Inc (SSDI)

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1SS181TE85R Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SOLID STATE DEVICES INC TOSHIBA CORP
Package Description O-LELF-R2 SC-59, TO-236MOD, 3 PIN
Pin Count 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.80 8541.10.00.70
Case Connection ISOLATED
Configuration SINGLE COMMON ANODE, 2 ELEMENTS
Diode Element Material SILICON SILICON
Diode Type RECTIFIER DIODE RECTIFIER DIODE
Forward Voltage-Max (VF) 2.7 V 1.2 V
JESD-30 Code O-LELF-R2 R-PDSO-G3
Non-rep Pk Forward Current-Max 25 A 2 A
Number of Elements 1 2
Number of Phases 1 1
Number of Terminals 2 3
Operating Temperature-Max 175 °C 125 °C
Output Current-Max 1 A 0.1 A
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND RECTANGULAR
Package Style LONG FORM SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Rep Pk Reverse Voltage-Max 400 V 85 V
Reverse Recovery Time-Max 0.06 µs 0.004 µs
Surface Mount YES YES
Technology SCHOTTKY
Terminal Form WRAP AROUND GULL WING
Terminal Position END DUAL
Base Number Matches 1 1
Application FAST RECOVERY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Dissipation-Max 0.225 W
Reference Standard AEC-Q101
Reverse Current-Max 0.5 µA
Reverse Test Voltage 80 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare 1SS181TE85R with alternatives