SDR1MS
vs
1N116
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
MICROSEMI CORP
|
| Package Description |
HERMETIC SEALED PACKAGE-2
|
|
| Pin Count |
2
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
|
| Additional Feature |
METALLURGICALLY BONDED
|
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JESD-30 Code |
E-XALF-W2
|
|
| Non-rep Pk Forward Current-Max |
25 A
|
0.5 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
|
| Output Current-Max |
1 A
|
0.03 A
|
| Package Body Material |
UNSPECIFIED
|
|
| Package Shape |
ELLIPTICAL
|
|
| Package Style |
LONG FORM
|
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
1000 V
|
60 V
|
| Reverse Recovery Time-Max |
0.07 µs
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
WIRE
|
|
| Terminal Position |
AXIAL
|
|
| Base Number Matches |
1
|
4
|
| Rohs Code |
|
No
|
| Forward Voltage-Max (VF) |
|
1 V
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
90 °C
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare SDR1MS with alternatives