SDR6306TX
vs
1N6306HR
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
DIGITRON SEMICONDUCTORS
|
| Part Package Code |
DO-5
|
|
| Package Description |
HERMETIC SEALED PACKAGE-1
|
|
| Pin Count |
1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Application |
EFFICIENCY
|
ULTRA FAST RECOVERY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| JEDEC-95 Code |
DO-5
|
DO-5
|
| JESD-30 Code |
O-MUPM-D1
|
O-MUPM-D1
|
| Non-rep Pk Forward Current-Max |
800 A
|
800 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
1
|
1
|
| Output Current-Max |
70 A
|
70 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
150 V
|
150 V
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.06 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
HIGH RELIABILITY
|
| Forward Voltage-Max (VF) |
|
1.18 V
|
| Operating Temperature-Max |
|
175 °C
|
| Operating Temperature-Min |
|
-65 °C
|
| Reference Standard |
|
MIL-19500
|
| Reverse Current-Max |
|
25 µA
|
|
|
|
Compare SDR6306TX with alternatives
Compare 1N6306HR with alternatives