SDR950/61
vs
SDR950/61TXV
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
SOLID STATE DEVICES INC
|
SOLID STATE DEVICES INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Application |
HYPER FAST RECOVERY
|
HYPER FAST RECOVERY
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
1.25 V
|
| JEDEC-95 Code |
TO-61
|
TO-61
|
| JESD-30 Code |
O-MUPM-D2
|
O-MUPM-D2
|
| Non-rep Pk Forward Current-Max |
450 A
|
450 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
200 °C
|
200 °C
|
| Output Current-Max |
60 A
|
60 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
100 V
|
100 V
|
| Reverse Recovery Time-Max |
0.035 µs
|
0.035 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Base Number Matches |
4
|
1
|
| Package Description |
|
O-MUPM-D2
|
| Operating Temperature-Min |
|
-65 °C
|
| Reference Standard |
|
MIL-19500
|
| Reverse Current-Max |
|
100 µA
|
|
|
|