SDURF830
vs
MBR1580-BP-HF
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
SANGDEST MICROELECTRONICS (NANJING) CO LTD
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Package Description |
ITO-220AC, 3/2 PIN
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Additional Feature |
FREE WHEELING DIODE, SNUBBER DIODE, LOW LEAKAGE CURRENT
|
LOW POWER LOSS
|
| Application |
ULTRA FAST RECOVERY
|
EFFICIENCY
|
| Case Connection |
ISOLATED
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.3 V
|
0.84 V
|
| JEDEC-95 Code |
TO-220AC
|
TO-220AC
|
| JESD-30 Code |
R-PSFM-T2
|
R-PSFM-T2
|
| Non-rep Pk Forward Current-Max |
80 A
|
150 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Rep Pk Reverse Voltage-Max |
300 V
|
80 V
|
| Reverse Current-Max |
10 µA
|
200 µA
|
| Reverse Recovery Time-Max |
0.045 µs
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Output Current-Max |
|
15 A
|
| Technology |
|
SCHOTTKY
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare SDURF830 with alternatives
Compare MBR1580-BP-HF with alternatives