SE555N vs MC1455BDR2 feature comparison

SE555N Signetics

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MC1455BDR2 Motorola Mobility LLC

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SIGNETICS CORP MOTOROLA INC
Package Description DIP-8 SOP,
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDIP-T8 R-PDSO-G8
JESD-609 Code e0
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Surface Mount NO YES
Technology BIPOLAR
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 5 3
Part Package Code SOIC
Pin Count 8
Analog IC - Other Type TIMER
Length 4.9 mm
Number of Functions 1
Seated Height-Max 1.75 mm
Supply Current-Max (Isup) 15 mA
Supply Voltage-Max (Vsup) 16 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Width 3.9 mm

Compare SE555N with alternatives

Compare MC1455BDR2 with alternatives