SFH601-2
vs
SFH615AGB-X016
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
TELEFUNKEN MICROELECTRONICS GMBH
|
SIEMENS A G
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8541.40.80.00
|
8541.40.80.00
|
| Current Transfer Ratio-Min |
22%
|
|
| Forward Current-Max |
0.06 A
|
0.06 A
|
| Forward Voltage-Max |
1.65 V
|
|
| Isolation Voltage-Max |
5300 V
|
5300 V
|
| JESD-609 Code |
e0
|
|
| Mounting Feature |
THROUGH HOLE MOUNT
|
|
| Number of Elements |
1
|
1
|
| On-State Current-Max |
0.05 A
|
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Power Dissipation-Max |
0.15 W
|
|
| Surface Mount |
NO
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Base Number Matches |
7
|
2
|
| Package Description |
|
DIP-4
|
| Additional Feature |
|
UL RECOGNIZED, HIGH RELIABILITY, VDE APPROVED
|
| Coll-Emtr Bkdn Voltage-Min |
|
70 V
|
| Configuration |
|
SINGLE
|
| Current Transfer Ratio-Nom |
|
100%
|
| Dark Current-Max |
|
100 nA
|
| Optoelectronic Device Type |
|
TRANSISTOR OUTPUT OPTOCOUPLER
|
|
|
|
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