SG117AG vs LM317KMDC feature comparison

SG117AG Microsemi Corporation

Buy Now Datasheet

LM317KMDC Texas Instruments

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MICROSEMI CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code TO-257 DIE
Package Description , SIP3,.1TB DIE, DIE OR CHIP
Pin Count 3
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Adjustability ADJUSTABLE ADJUSTABLE
Dropout Voltage1-Nom 3.5 V 3 V
Input-Output Voltage Differential-Max 40 V
Input-Output Voltage Differential-Min 3 V
JESD-30 Code R-MSFM-T3 X-XUUC-N
Line Regulation-Max (%/V) 0.02 0.07
Load Regulation-Max(%) 1% 1.5%
Number of Functions 1 1
Number of Outputs 1 1
Number of Terminals 3
Operating Temperature TJ-Max 150 °C 125 °C
Operating Temperature TJ-Min -55 °C
Output Current1-Max 1.5 A 1.5 A
Output Voltage1-Max 37 V 37 V
Output Voltage1-Min 1.2 V 1.2 V
Package Body Material METAL UNSPECIFIED
Package Equivalence Code SIP3,.1TB DIE OR CHIP
Package Shape RECTANGULAR UNSPECIFIED
Package Style FLANGE MOUNT UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Regulator Type ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position SINGLE UPPER
Base Number Matches 3 2
Pbfree Code Yes
Moisture Sensitivity Level 1
Package Code DIE
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare SG117AG with alternatives

Compare LM317KMDC with alternatives