SG1626Y
vs
ISL6208IBZ-T
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
INTERSIL CORP
|
| Part Package Code |
DIP
|
QFN, SOIC
|
| Package Description |
DIP, DIP8,.3
|
ROHS COMPLIANT, PLASTIC, MS-012AA, SOIC-8
|
| Pin Count |
8
|
8, 8
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| High Side Driver |
NO
|
YES
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
R-GDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Length |
10.415 mm
|
4.9 mm
|
| Number of Functions |
2
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
100 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Peak Current Limit-Nom |
3 A
|
4 A
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.75 mm
|
| Supply Voltage-Max |
20 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
15 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Turn-off Time |
0.04 µs
|
|
| Turn-on Time |
0.05 µs
|
0.03 µs
|
| Width |
7.62 mm
|
3.9 mm
|
| Base Number Matches |
3
|
2
|
| Factory Lead Time |
|
26 Weeks
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare SG1626Y with alternatives
Compare ISL6208IBZ-T with alternatives