SG55461Y/883B vs M38510/12907BPA feature comparison

SG55461Y/883B Microsemi Corporation

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M38510/12907BPA Texas Instruments

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer SILICON GENERAL INC TEXAS INSTRUMENTS INC
Part Package Code DIP DIP
Package Description , CERAMIC, DIP-8
Pin Count 8 8
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Input Characteristics STANDARD
Interface IC Type AND GATE BASED PERIPHERAL DRIVER AND GATE BASED PERIPHERAL DRIVER
JESD-30 Code R-GDIP-T8 R-GDIP-T8
Number of Functions 2 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Characteristics OPEN-COLLECTOR
Output Current Flow Direction SINK SINK
Output Peak Current Limit-Nom 0.4 A 0.5 A
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 76 mA
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Turn-off Time 0.055 µs
Turn-on Time 0.04 µs
Base Number Matches 1 1
Built-in Protections OVER CURRENT
Package Code DIP
Screening Level MIL-STD-883

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