SI4704-D60-GM
vs
SI4704-D60-GM
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
SILICON LABORATORIES INC
|
SKYWORKS SOLUTIONS INC
|
| Part Package Code |
QFN
|
|
| Package Description |
QFN-20
|
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Silicon Labs
|
|
| Consumer IC Type |
AUDIO SINGLE CHIP RECEIVER
|
AUDIO SINGLE CHIP RECEIVER
|
| Demodulation Type |
FM
|
FM
|
| Harmonic Distortion |
0.1%
|
0.1%
|
| JESD-30 Code |
R-XQCC-N20
|
R-XQCC-N20
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Output Voltage-Nom (FM) |
80 mV
|
80 mV
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC20,.12SQ,20
|
LCC20,.12SQ,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.6 mm
|
0.6 mm
|
| Signal to Noise Ratio-Nom (FM) |
58 dB
|
58 dB
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare SI4704-D60-GM with alternatives
Compare SI4704-D60-GM with alternatives