SMBJ5937B
vs
SMBJ5937BHE3-TP
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICRO COMMERCIAL COMPONENTS CORP
|
| Package Description |
PLASTIC, SMBJ, 2 PIN
|
SMB, 2 PIN
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JEDEC-95 Code |
DO-214AA
|
DO-214AA
|
| JESD-30 Code |
R-PDSO-J2
|
R-PDSO-C2
|
| JESD-609 Code |
e0
|
e3
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-65 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
1.25 W
|
1.5 W
|
| Reference Voltage-Nom |
33 V
|
33 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
J BEND
|
C BEND
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
10
|
| Voltage Tol-Max |
5%
|
5%
|
| Working Test Current |
11.4 mA
|
11.4 mA
|
| Base Number Matches |
3
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.50
|
| Samacsys Manufacturer |
|
MCC
|
| Dynamic Impedance-Max |
|
33 Ω
|
| Forward Voltage-Max (VF) |
|
1.5 V
|
| Knee Impedance-Max |
|
800 Ω
|
| Reference Standard |
|
AEC-Q101
|
| Reverse Current-Max |
|
0.001 µA
|
| Reverse Test Voltage |
|
25.1 V
|
|
|
|
Compare SMBJ5937B with alternatives
Compare SMBJ5937BHE3-TP with alternatives