SMD100
vs
MF-SM100-AP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TE CONNECTIVITY LTD
|
BOURNS INC
|
| Package Description |
CHIP
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8533.40.80.70
|
|
| Additional Feature |
0.12-0.48 OHMS AT 20 DEG CEL
|
0.12 OHMS MINIMUM AT 23 DEG CEL
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Height |
3 mm
|
|
| Package Length |
7.98 mm
|
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Package Width |
5.44 mm
|
|
| Packing Method |
TR
|
BULK
|
| Rated Power Dissipation (P) |
1.5 W
|
|
| Resistance |
0.3 Ω
|
|
| Resistor Type |
PTC THERMISTOR
|
PTC RESETTABLE FUSE
|
| Surface Mount |
YES
|
YES
|
| Terminal Placement |
END
|
END
|
| Terminal Shape |
FLAT
|
FLAT
|
| Thermistor Application |
OVERLOAD PROTECTION
|
OVERLOAD PROTECTION
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
Tin (Sn)
|
|
|
|
Compare SMD100 with alternatives
Compare MF-SM100-AP with alternatives