SN74HC00-W vs MM74HC00N feature comparison

SN74HC00-W Texas Instruments

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MM74HC00N Rochester Electronics LLC

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Source Content uid SN74HC00-W
Pbfree Code No Yes
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer TEXAS INSTRUMENTS INC ROCHESTER ELECTRONICS LLC
Part Package Code WAFER DIP
Package Description DIE, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-XUUC-N R-PDIP-T14
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIE DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 115 ns 113 ns
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Base Number Matches 1 4
Rohs Code Yes
Pin Count 14
JESD-609 Code e3
Length 19.18 mm
Number of Terminals 14
Seated Height-Max 5.08 mm
Terminal Finish MATTE TIN
Terminal Pitch 2.54 mm
Width 7.62 mm

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