SN74HC00J4 vs TC74HC00AP feature comparison

SN74HC00J4 Texas Instruments

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TC74HC00AP Toshiba America Electronic Components

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Package Description Dip, Dip14,.3 Dip, Dip14,.3
Reach Compliance Code Unknown Unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family Hc Hc/Uh
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Length 19.56 Mm 19.25 Mm
Load Capacitance (CL) 50 Pf 50 Pf
Logic IC Type Nand Gate Nand Gate
Max I(ol) 0.0052 A 0.004 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material Ceramic, Glass-Sealed Plastic/Epoxy
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape Rectangular Rectangular
Package Style In-Line In-Line
Power Supply Current-Max (ICC) 0.02 Ma
Prop. Delay@Nom-Sup 23 Ns 19 Ns
Propagation Delay (tpd) 115 Ns 95 Ns
Schmitt Trigger No No
Seated Height-Max 5.08 Mm 4.45 Mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount No No
Technology Cmos Cmos
Temperature Grade Industrial Industrial
Terminal Form Through-Hole Through-Hole
Terminal Pitch 2.54 Mm 2.54 Mm
Terminal Position Dual Dual
Width 7.62 Mm 7.62 Mm
Base Number Matches 2 2
Part Package Code DIP
Pin Count 14
Peak Reflow Temperature (Cel) Not Specified
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) Not Specified