SN74HC138DBR vs TC74HC137AF-TP1 feature comparison

SN74HC138DBRG4 Texas Instruments

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TC74HC137AF-TP1 Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TEXAS INSTRUMENTS INC TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SSOP, SSOP16,.3 SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 3 ENABLE INPUTS ADDRESS LATCHES; 2 ENABLE INPUTS
Family HC/UH HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 6.2 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 225 ns 41 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 5.3 mm
Base Number Matches 2 3

Compare SN74HC138DBR with alternatives

Compare TC74HC137AF-TP1 with alternatives