SN74LVC1G66YZPR
vs
FSAT66L6X
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
FAIRCHILD SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
SOIC
|
| Package Description |
GREEN, WCSP-5
|
1 MM, MICROPAK-6
|
| Pin Count |
5
|
6
|
| Reach Compliance Code |
unknown
|
compliant
|
| Analog IC - Other Type |
SPST
|
SPST
|
| JESD-30 Code |
R-PBGA-B5
|
R-XDSO-N6
|
| JESD-609 Code |
e1
|
e4
|
| Length |
1.4 mm
|
1.45 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
6
|
| Off-state Isolation-Nom |
42 dB
|
50 dB
|
| On-state Resistance-Max (Ron) |
20 Ω
|
30 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
VFBGA
|
VSON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.5 mm
|
0.55 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
2.3 V
|
2.3 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
6.9 ns
|
9 ns
|
| Switch-on Time-Max |
6.5 ns
|
7 ns
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
NICKEL GOLD
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
0.9 mm
|
1 mm
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.39.00.01
|
| Normal Position |
|
NO
|
| Package Equivalence Code |
|
SOLCC6,.04,20
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare SN74LVC1G66YZPR with alternatives
Compare FSAT66L6X with alternatives