SN74LVC1G74DCUR-P
vs
HD74LV2G74AUS
feature comparison
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
VSSOP, TSSOP8,.12,20
|
SSOP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LVC/LCX/Z
|
LV/LV-A/LVX/H
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
| Length |
2.3 mm
|
2.3 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
175000000 Hz
|
|
| Max I(ol) |
0.024 A
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
VSSOP
|
| Package Equivalence Code |
TSSOP8,.12,20
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Prop. Delay@Nom-Sup |
5.9 ns
|
|
| Propagation Delay (tpd) |
14.4 ns
|
42.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
2 mm
|
2 mm
|
| fmax-Min |
200 MHz
|
110 MHz
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare SN74LVC1G74DCUR-P with alternatives
Compare HD74LV2G74AUS with alternatives