SPAKMC332ACPV16
vs
5962-9150101MXA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
THOMSON-CSF COMPSANTS SPECIFIC
|
| Package Description |
PLASTIC, QFP-132
|
QFP, QFP132,1.08SQ
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
|
| CPU Family |
68000
|
68000
|
| Clock Frequency-Max |
16 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
16
|
|
| JESD-30 Code |
S-PQFP-G132
|
S-XQFP-G132
|
| Length |
20 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of I/O Lines |
31
|
|
| Number of Terminals |
132
|
132
|
| On Chip Program ROM Width |
16
|
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
QFP
|
QFP
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
QFP132,1.08SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
2048
|
2048
|
| ROM (words) |
32768
|
|
| ROM Programmability |
EEPROM
|
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
16 MHz
|
16.78 MHz
|
| Supply Current-Max |
134 mA
|
124 mA
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
20 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
| Base Number Matches |
4
|
5
|
| ECCN Code |
|
3A001.A.2.C
|
| JESD-609 Code |
|
e0
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb) - hot dipped
|
|
|
|
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