SPAKMC332AVFV16
vs
TS68332VA16
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
THOMSON ELECTRON TUBES & DEVICES CORP
|
| Package Description |
20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH, LQFP-144
|
QFP, QFP132,1.2SQ
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
|
| Address Bus Width |
24
|
|
| Bit Size |
32
|
32
|
| CPU Family |
68000
|
68000
|
| Clock Frequency-Max |
16 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
16
|
|
| JESD-30 Code |
S-PQFP-G144
|
S-XQFP-G132
|
| Length |
20 mm
|
|
| Number of I/O Lines |
24
|
|
| Number of Terminals |
144
|
132
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
LFQFP
|
QFP
|
| Package Equivalence Code |
QFP144,.87SQ,20
|
QFP132,1.2SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
2048
|
2048
|
| Seated Height-Max |
1.6 mm
|
|
| Speed |
16 MHz
|
16.78 MHz
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.635 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
20 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
| Base Number Matches |
4
|
5
|
| JESD-609 Code |
|
e0
|
| Supply Current-Max |
|
125 mA
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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