SPC5123YVY400B vs MPC8306VMADDCA feature comparison

SPC5123YVY400B NXP Semiconductors

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MPC8306VMADDCA Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Package Description 27 X 27 MM, 2.25 HEIGHT, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, TEBGA-516 19 MM X 19 MM, 0.80 MM PITCH, LEAD FREE, PLASTIC, MAPBGA-369
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 16 Weeks
Samacsys Manufacturer NXP
Address Bus Width 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 35 MHz 66.67 MHz
External Data Bus Width 32
Format FIXED POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B516 S-PBGA-B369
JESD-609 Code e2 e2
Length 27 mm 19 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 516 369
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA LFBGA
Package Equivalence Code BGA516,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified COMMERCIAL
Screening Level AEC-Q100
Seated Height-Max 2.55 mm 1.61 mm
Speed 400 MHz 266 MHz
Supply Voltage-Max 1.47 V
Supply Voltage-Min 1.33 V
Supply Voltage-Nom 1.4 V 1 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Silver (Sn/Ag) TIN COPPER/TIN SILVER
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 27 mm 19 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 3
Pbfree Code Yes
Part Package Code BGA
Pin Count 369

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