SPC5200CBV400B vs UPD30500AS2-266 feature comparison

SPC5200CBV400B NXP Semiconductors

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UPD30500AS2-266 NEC Electronics Group

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Rohs Code No
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEC ELECTRONICS CORP
Package Description 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 LBGA,
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 12 Weeks
Samacsys Manufacturer NXP
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 32 64
Bit Size 32 64
Boundary Scan YES NO
Clock Frequency-Max 66 MHz 100 MHz
External Data Bus Width 32 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B272 S-PBGA-B272
JESD-609 Code e0 e1
Length 27 mm 29 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3
Number of Terminals 272 272
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Equivalence Code BGA272,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 245 260
Qualification Status Not Qualified Not Qualified
Screening Level AEC-Q100
Seated Height-Max 2.65 mm 1.7 mm
Speed 400 MHz 266 MHz
Supply Voltage-Max 1.58 V 2.7 V
Supply Voltage-Min 1.42 V 2.5 V
Supply Voltage-Nom 1.5 V 2.6 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 10
Width 27 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
Part Package Code BGA
Pin Count 272

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