SPC5200CBV400R2 vs UPD30500BS2-300 feature comparison

SPC5200CBV400R2 NXP Semiconductors

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UPD30500BS2-300 NEC Electronics Group

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEC ELECTRONICS CORP
Package Description 27 X 27 MM, 1.27 MM PITCH, PLASTIC, BGA-272 LBGA,
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 2 Days
Additional Feature ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY FOR I/O
Address Bus Width 32 64
Boundary Scan YES NO
Clock Frequency-Max 35 MHz 100 MHz
External Data Bus Width 32 64
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B272 S-PBGA-B272
JESD-609 Code e0 e0
Length 27 mm 29 mm
Low Power Mode YES NO
Moisture Sensitivity Level 3
Number of Terminals 272 272
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 1.7 mm
Speed 400 MHz 300 MHz
Supply Voltage-Max 1.58 V 1.9 V
Supply Voltage-Min 1.42 V 1.7 V
Supply Voltage-Nom 1.5 V 1.8 V
Surface Mount YES YES
Technology CMOS MOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 29 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 2 1
Part Package Code BGA
Pin Count 272
Bit Size 64

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